Resin diamond grinding wheel for semiconductor, for sapphire, silicon, resin bond diamond wheel
Delivery term:The date of payment from buyers deliver within days-
Price:
Negotiable
- minimum:
- Total supply:
-
Delivery term:
The date of payment from buyers deliver within days
-
seat:
Beijing
-
Validity to:
Long-term effective
-
Last update:
2017-12-18 15:56
-
Browse the number:
121
+
Zibo Hans International Co. Ltd
- Contactaixin:
Contactaixin:
xydiamond(Mr.)
-
telephone:
-
Area:
Beijing
Address:313, 2nd Building, 145, Zhengtong Road, Zhangdian, Zibo, Shandong, China (255086)
- Website:
+
Model Number: D255-#0040
Brand Name: XINYA
Key Specifications/Special Features:
Ceramicdiamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors material have the highest sharpness and the best grinding effectThey are designed for grinding the surface of silicone waferand sapphire wafer
Shipping Information:
- FOB Port: Shanghai
- Lead Time: 10 - 15 days
Main Export Markets:
- Asia
- Australasia
- Central/South America
- Eastern Europe
- Mid East/Africa
- North America
- Western Europe